zymet ua-2605-b返修edgebond胶提高板级可靠性大WLCSP

图1。WLP保税与返修edgebond胶粘剂，礼貌zymet，Inc.

Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work has been performed and published in the Proceedings of the SMTA International 2016 conference, held in Rosemont, IL, “Reworkable Edgebond Applied Wafer-Level Chip-Scale Package (WLCSP) Thermal Cycling Performance Enhancement at Elevated Temperature” in a collaborative effort between Portland State University, Cisco, and Zymet. Additional work was published in the 66th Electronic Components and Technology Conference, in Las Vegas, “Effect of Local Grain Distribution and Enhancement on Edgebond Applied Wafer-Level Chip-Scale Package (WLCSP) Thermal Cycle Performance”. In the study, 8×8 mm WLCSP’s, assembled on organic substrate, were subjected to 0°C to 100°C thermal cycling. Absent adhesive, first failure occurs at 355 cycles and characteristic life is 638 cycles. With the reworkable edgebond adhesive, no failures were encountered at 2000 cycles.

WLCSP的系数对硅的热膨胀，2.6 ppm /°C，和董事会的热膨胀系数大约是17 ppm /°C.不匹配的CTE结果在相当大的压力的时候，两组装，由焊料伴随早期失效的广泛的应变诱导的晶粒再结晶证明。使用返修edgebond胶大幅减少损伤的积累，从而增加热循环性能。

使用zymet的返修edgebond胶的好处，在它的一个返修底部填充剂，具有重要意义。毛细管流动无需板预热和停留时间。填充空隙和焊剂填充不被淘汰的风险。而且，当执行返工，没有必要删除底部填充物残留物从整个足迹的包，几乎消除了风险的垫损坏。

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zymet是全球胶粘剂及密封剂供应商，专注于使材料在电子产业的发展和制造。对于返修edgebond胶粘剂信息的请求，或其他高级材料，可以通过电子邮件提交info@zymet.com。

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